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Development of Chip Composites with Improved Mechanical Performance

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Development of Chip Composites with Improved Mechanical Performance Attributes Using Hybrid Multi-Scale Modelling Methods


The in-process waste generated during manufacture of composite parts can be reused by making laminates using prepreg scrap. Development of optimal composites out of prepreg scrap requires that the dependence of the mechanical properties on the chip configurations (shape, size, preferred orientation) must be well understood.  A hybrid multiscale tool to calculate the effective stiffness of chip composites is developed. The key innovation of this process is that it uses a combination of finite element calculations and analytic methods (hybrid) and calculations at both the constituent and the composite level (multiscale). In this method the chips can be modelled as inclusions of any shape, including outof-plane distorted complex shapes and the voids are modelled as ellipsoidal inclusions. Apart from estimating the effective stiffness, this model is also capable of predicting the stress distribution and average stress in the chips. Using this method, a number of different chip shapes are considered, and we have ascertained the shape leading to highest stiffness and most equitable stress distribution. Based on these insights, we have improved the chip composite manufacturing process, and developed composites with superior mechanical performance attributes.


Authors: Atul Jain, Bo Cheng Jin, Steven R. Nutt


Conference: CAMX 2016 – Anaheim


SKU/Code: TP16-0147


Pages: 11

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