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Mechanical and Dielectric Properties of Adhesively Bonded Composite

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Mechanical and Dielectric Properties of Adhesively Bonded Composite Joint with Interfacial Defects


Durability of fiber reinforced composite materials and joints is extremely important for their continued growth in many applications. Formation of defects during the manufacturing, adhesive bonding, and repair process can be very detrimental to the performance of a composite structure. Although the substrates may remain in contact, interfacial defects causes a weak joint called “Kissing bond” which is often difficult to characterize and a major concern for reliability. Despite progress in detection of defects using popular nondestructive methods, significant challenges still remain in quantifying the resulting loss of properties. Although the effect of defect on mechanical properties has been the traditional focus of investigation but understanding of the change in electrical response is very limited. The objective of this study is to explore the effects of interfacial defects on the strength of adhesively bonded lap joints made of laminated composite substrate and epoxy adhesive. The proposed new concept relies on the fact that heterogeneity at the material interfaces changes charge polarization inside a material when subjected to an AC electric field and this fundamental material behavior can be quantified using Broadband Dielectric Spectroscopy (BbDS) technique. Both bulk and spatial distribution of dielectric properties were measured to represent the state of weak interface. Results show that changes in dielectric properties (e.g. complex permittivity) can be utilized as a quantitative measure of the remaining strength of a weak joint under tensile loading. Details of experimental methods, and results are included in the paper.


Author: Prasun Majumdar


Conference: SAMPE Seattle 2017


SKU/Code: SE17--0786

Pages: 13

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