Correlation of the Dielectric Properties of an Epoxy Resin with the Degree of Cure
Dielectric analysis can monitor the curing of a resin system during production. It measures the permittivity changes of the resin in a capacitor set-up while curing. For the correlation, first the degree of cure was analysed by differential scanning calorimetry and modelled as a function of time. The dielectric properties were measured simultaneously with the viscosity in a rheometer and then analysed, considering the feasibility and sensitivity to the cure degree. A correlation regarding the degree of cure was obtained.
Authors: Amke Eggers, Dilmurat Abliz, Gerhard Ziegmann, Dieter Meiners
Conference: SAMPE Europe Conference 2016